发明名称 |
Solid-state imaging device, electronic apparatus, and method for manufacturing solid-state imaging device |
摘要 |
A solid state imaging device that includes a semiconductor substrate having a plurality of photodiodes thereon and a first wiring portion, a second wiring portion and a third wiring portion, a first wiring layer over the semiconductor substrate and which includes a plurality of metal films and extends across all the wiring portions, and a second wiring layer over the first wiring layer and which extends across the first wiring portion and the second wiring portion. |
申请公布号 |
EP2251905(A3) |
申请公布日期 |
2013.08.28 |
申请号 |
EP20100004648 |
申请日期 |
2010.05.03 |
申请人 |
SONY CORPORATION |
发明人 |
MIZUTA, KYOHEI;ITONAGA, KAZUICHIRO |
分类号 |
H01L27/146;H01L27/14;H04N5/335;H04N5/369;H04N5/372;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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