发明名称 |
Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method |
摘要 |
A semiconductor package method for co-packaging high-side (HS) and low-side (LS) semiconductor chips is disclosed. The HS and LS semiconductor chips are attached to two opposite sides of a lead frame, with a bottom drain electrode of the LS chip connected to a top side of the lead frame and a top source electrode of the HS chip connected to a bottom side of the lead frame through a solder ball. The stacking configuration of HS chip, lead frame and LS chip reduces the package size. A bottom metal layer covering the bottom of HS chip exposed outside of the package body provides both electrical connection and thermal conduction.
|
申请公布号 |
US8519520(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US201113302077 |
申请日期 |
2011.11.22 |
申请人 |
GONG YUPING;XUE YAN XUN;ZHAO LIANG;ALPHA & OMEGA SEMICONDUCTOR, INC. |
发明人 |
GONG YUPING;XUE YAN XUN;ZHAO LIANG |
分类号 |
H01L23/495;H01L23/34 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|