发明名称 CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a circuit board having an opening provided on an insulating film in which an opening ratio is sufficiently improved, and to provide a method for manufacturing a circuit board and a display device.SOLUTION: A circuit board includes a glass substrate and an insulating film. The insulating film has at least a first opening and a second opening. When a main surface of the substrate is viewed in plane, the circuit board includes a first conductor overlapping the first opening, a second conductor or a semiconductor which is electrically connected to the first conductor, a third conductor overlapping the second opening, and a fourth conductor electrically connected to the third conductor. A layer in which the second conductor or the semiconductor is provided is positioned closer to the glass substrate side than a layer in which the fourth conductor is provided, and the first conductor is a circuit board thicker than the third conductor.
申请公布号 JP2013165243(A) 申请公布日期 2013.08.22
申请号 JP20120028838 申请日期 2012.02.13
申请人 SHARP CORP 发明人 KAIGAWA HIROYUKI
分类号 H01L21/768;G09F9/00;G09F9/30;H01L21/336;H01L29/786 主分类号 H01L21/768
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