| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of a conductor pad for connection of a multilayer ceramic substrate used for electrical connection with an external device such that a film is separated because film adhesion of a conductor pad for connection deteriorates due to thermal and mechanical stress during an assembly process or after assembly.SOLUTION: In a multilayer ceramic substrate, deterioration in film adhesion of a connection conductor pad 20 is prevented by burying of a part of a conductor part on a periphery of a connection conductor pad 20 in a ceramic substrate 2 to reinforce the connection conductor pad 20. In addition, the connection conductor pad is reinforced by extension of the conductor part which becomes a starting point of separation of the connection conductor pad 20 and coating of the extension part with a ceramic layer. |
