发明名称 HOLDER FOR SEMICONDUCTOR PACKAGE
摘要 A holder includes a main body on which a plurality of circuit lines are laid out. The main body is integrally molded from a plastic material and can be formed thereon with a circuit layout by a specific process, such as a laser activated and chemical plating process. The main body includes a chamber having an opening formed at the top side of the main body, a base surface, and a stepped wall. Each of the circuit lines is arranged on the stepped wall of the chamber stereoscopically. Thus, the holder does not need to make a hole running therethrough to reach electrical connection between surfaces of different heights. Besides, the circuit lines are arranged stereoscopically, so they can extend to the top and bottom sides of the holder. Therefore, the holder can be applied to not only the traditional package but an upside-down package.
申请公布号 US2013213698(A1) 申请公布日期 2013.08.22
申请号 US201213540967 申请日期 2012.07.03
申请人 BIAR JEFF;HUANG CHIH-KUNG;WU MING-CHING;DOMINTECH CO., LTD 发明人 BIAR JEFF;HUANG CHIH-KUNG;WU MING-CHING
分类号 H05K1/03 主分类号 H05K1/03
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