发明名称 |
SILICON SENSING STRUCTURE TO DETECT THROUGH-PLANE MOTION A PLANE OF MATERIAL WITH THERMAL EXPANSION SUBSTANTIALLY DIFFERENT FROM THAT OF SILICON |
摘要 |
<p>A pressure transducer is provided that has a transducer body with a rim, a diaphragm that deflects in response to pressure and a sensor bonded to the diaphragm at the rim and at a center of the diaphragm. The sensor detects deflection of the metal diaphragm. The sensor and diaphragm are made of different materials. A thermal expansion difference between the sensor and the diaphragm is accommodated by flexures in the sensor that accept relative motion in a radial direction of the metal diaphragm with little effect on a sensitivity of the silicon structure to motion in an axial direction of the diaphragm.</p> |
申请公布号 |
EP2201346(B1) |
申请公布日期 |
2013.08.21 |
申请号 |
EP20080833442 |
申请日期 |
2008.09.29 |
申请人 |
MEGGITT (SAN JUAN CAPISTRANO), INC. |
发明人 |
SUMINTO, JAMES, TJAN-MENG;WILNER, LESLIE, BRUCE |
分类号 |
G01L9/02;G01L9/00;G01L19/04 |
主分类号 |
G01L9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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