发明名称 |
Electrostatic discharge (ESD) protection for electronic devices using wire-bonding |
摘要 |
A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.
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申请公布号 |
US8514534(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US20100839528 |
申请日期 |
2010.07.20 |
申请人 |
BANDY, IV WILLIAM T.;BODAY DYLAN J.;GOLCHER PETER J.;IBEN ICKO E. T.;SHAHIDI SASSAN K.;TANG JOYCE L. S.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BANDY, IV WILLIAM T.;BODAY DYLAN J.;GOLCHER PETER J.;IBEN ICKO E. T.;SHAHIDI SASSAN K.;TANG JOYCE L. S. |
分类号 |
H02H9/00;H02H3/20;H02H3/22;H02H9/04 |
主分类号 |
H02H9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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