发明名称 APPLYING DEVICE AND APPLYING METHOD FOR ADHESIVE TAPE, AND DEVICE FOR MOUNTING ELECTRONIC PART
摘要 <p>PURPOSE: An adhesive device of adhesive tape, an adhesive method thereof, and a mounting device of an electronic component improve productivity by omitting an extraction process of the adhesive tape. CONSTITUTION: A transfer chuck (37) intermittently transfers release tape by a fixed length. A holding body (48) has an electronic component on the lower surface. The holding body is placed to face adhesive tape. A pair of cutters (42) is installed on both sides of the holding body. A pressurization member (54) bonds the adhesive tape cut by the cutters to one end part of the electronic component. [Reference numerals] (32) Release tape; (33) Adhesive tape; (38) Second Z driving source; (42) Cutter; (48) Holding body; (5) TAB component; (54) Pressurization member</p>
申请公布号 KR20130092473(A) 申请公布日期 2013.08.20
申请号 KR20130013713 申请日期 2013.02.07
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 HIROSE KEIGOU
分类号 H05K13/04;C09J7/02 主分类号 H05K13/04
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