| 摘要 |
A device includes a circuit board and a dual sided package. The dual sided package fits into an opening provided in the circuit board. The dual sided package includes a first portion with a first set of integrated circuits (ICs), a second portion with a second set of ICs, and a package substrate provided between the first portion and the second portion. The package substrate connects to the circuit board, and the first portion and the second portion face opposite directions.
|
