| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that allows an increase in size of an antenna in a package without degrading the performance of a semiconductor chip.SOLUTION: In a semiconductor device 1, a semiconductor chip 11 is disposed in one of a region of four region in a semiconductor package 12 that are divided by lines formed by connecting middle points of two pairs of sides facing each other of a semiconductor package 12; and the gravity center of the semiconductor chip 11 is disposed outside a closed curve composed of a line formed by straightly connecting a first connection point P17a to which an antenna 14 and a bonding wire 17a are connected and a second connection point P17b to which the antenna 14 and a bonding wire 17b are connected, and a line formed by connecting the first connection point P17a and the second connection point P17b along the antenna 14. |
