发明名称 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRO-OPTIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a circuit board and a method for manufacturing the circuit board, in which disconnection of a line due to a stepped portion on a side face of a contact hole is substantially prevented, and to provide an electro-optic device having the circuit board.SOLUTION: A circuit board includes a plurality of elements, a plurality of conductive layers respectively connected to the elements, and an insulating layer disposed between the element and the conductive layer, on an insulating substrate. The insulating layer includes a first insulating layer covering the element and a second insulating layer formed on the first insulating layer. The insulating layer further includes a plurality of contact holes penetrating both of the first insulating layer and the second insulating layer in a thickness direction. A side face of the first insulating layer and a side face of the second insulating layer are in contact with each other in at least a part in the contact hole. The conductive layer is formed along an upper face of the second insulating layer, at least a portion in the side face of the contact hole where the side face of the first insulating layer and the side face of the second insulating layer are in contact with each other, and a bottom face of the contact hole.
申请公布号 JP2013161028(A) 申请公布日期 2013.08.19
申请号 JP20120024894 申请日期 2012.02.08
申请人 JAPAN DISPLAY WEST CO LTD 发明人 TAKEUCHI SHUNPEI;OTA AKIO;MIZUNO MANABU;HIROSE TAKANARI
分类号 G02F1/1368 主分类号 G02F1/1368
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