| 摘要 |
PROBLEM TO BE SOLVED: To enable easy manufacturing of a compact semiconductor element having high heat radiation property, and provide a compact semiconductor element having high heat radiation property.SOLUTION: A semiconductor element manufacturing method comprises: bonding a plurality of IC chips 8 to predetermined positions of a single high heat dissipation material 10; and subsequently mounting 1-chip substrate 13 for rewiring on the IC chips 8. That is, by connecting the substrates 13 for rewiring to stand bumps 9 provided on a logic circuit surface of the IC chips 8 via ACF (Anisotropic Conductive Film) 16 disposed on each of the substrates 13 for rewiring, chip-on-chip mounting is performed. The method further comprises: subsequently, performing resin encapsulation by resin 18 on all of the IC chips 8 on which the substrate 13 for rewiring are mounted, respectively; and performing singulation by a dicing saw and the like to manufacture individual semiconductor elements. |
