SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To obtain a compact and highly reliable semiconductor module.SOLUTION: The semiconductor module includes: a solid insulator 10a which is formed on an insulating substrate 3 toward an end of the insulating substrate 3 with an end of a circuit electrode 2a on the insulating substrate 3 as a starting point; and a conductive layer 11a which is electrically connected to the circuit electrode 2a at an end part of the circuit electrode 2a and is formed on at least part of the solid insulator 10a.