发明名称 ELECTRONIC APPARATUS MODULE
摘要 PROBLEM TO BE SOLVED: To provide an electronic apparatus module which enables an electronic component to be soldered to a warped substrate.SOLUTION: In a thermoelectric conversion element module 11, thermoelectric elements 22 are soldered to one surface of each of first and second substrates 15, 26 and first and second heat exchangers 12, 25 are joined to the other surfaces of the substrates. Compared to thicknesses of first solder layers S1 respectively located at the center sides of the first and second substrates 15, 26 and on which the first thermoelectric element 22a is soldered, thicknesses of second and third solder layers S2, S3 located at the outer side of the first solder layers S1 and on which the second and third thermoelectric elements 22b, 22c are soldered respectively are formed so as to be thicker.
申请公布号 JP2013157348(A) 申请公布日期 2013.08.15
申请号 JP20120014390 申请日期 2012.01.26
申请人 TOYOTA INDUSTRIES CORP 发明人 SO SHINPEI;AKIYAMA YASUNARI
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
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