发明名称 |
METHOD OF PLANARIZING SUBSTRATE AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR USING THE SAME |
摘要 |
A method of planarizing a substrate includes forming a conductive pattern on a first surface of a base substrate, forming a positive photoresist layer on the base substrate and the conductive pattern, exposing the positive photoresist layer to light by irradiating a second surface of the base substrate opposite to the first surface with light, developing the positive photoresist layer to form a protruded portion on the conductive pattern, forming a planarizing layer on the base substrate and the protruded portion and eliminating the protruded portion.
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申请公布号 |
US2013210202(A1) |
申请公布日期 |
2013.08.15 |
申请号 |
US201213677172 |
申请日期 |
2012.11.14 |
申请人 |
SAMSUNG DISPLAY CO., LTD.;SAMSUNG DISPLAY CO., LTD. |
发明人 |
KONG HYANG-SHIK;SHIM SEUNG-BO;JU JIN-HO;KIM JUN-GI |
分类号 |
H01L29/786;H01L21/02 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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