发明名称 METHOD OF PLANARIZING SUBSTRATE AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR USING THE SAME
摘要 A method of planarizing a substrate includes forming a conductive pattern on a first surface of a base substrate, forming a positive photoresist layer on the base substrate and the conductive pattern, exposing the positive photoresist layer to light by irradiating a second surface of the base substrate opposite to the first surface with light, developing the positive photoresist layer to form a protruded portion on the conductive pattern, forming a planarizing layer on the base substrate and the protruded portion and eliminating the protruded portion.
申请公布号 US2013210202(A1) 申请公布日期 2013.08.15
申请号 US201213677172 申请日期 2012.11.14
申请人 SAMSUNG DISPLAY CO., LTD.;SAMSUNG DISPLAY CO., LTD. 发明人 KONG HYANG-SHIK;SHIM SEUNG-BO;JU JIN-HO;KIM JUN-GI
分类号 H01L29/786;H01L21/02 主分类号 H01L29/786
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