| 摘要 |
<p>Provided is an organic adhesive agent for a mold, that greatly reduces the occurrence of odor, stimulus, smoke, etc., during mold making, is capable of improving the handling properties of the obtained mold, and is capable of advantageously increasing the peel-back resistance thereof. Also provided are an RCS obtained using this kind of organic adhesive agent, and a mold having excellent properties and obtained by using said RCS. The organic adhesive agent for the mold is configured by combining: a non-black phenolic resin (A) and a resol-type phenolic resin (B) having a usage ratio, by mass, of A:B = 95:5-5:95; and at least an Arrhenius base and/or a Brønsted base, as a curing accelerator capable of accelerating the curing reaction of these phenolic resins.</p> |
