LIGHT EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a light emitting diode device manufacturing method capable of manufacturing a light emitting diode device while restraining damage of a light emitting diode element and a void on a sealing resin layer and restraining a load onto an apparatus, and a resultant light emitting diode device.SOLUTION: In a method, a light emitting diode device 1 in which a light emitting diode element 2 is sealed with a sealing resin layer 3 is manufactured. The sealing resin layer 3 is prepared and the light emitting diode element 2 is embedded in the sealing resin layer 3. The sealing resin layer 3 in which the light emitting diode element 2 is embedded is heated while being pressurized with a gas.