| 摘要 |
PURPOSE: A glass substrate cutting apparatus which includes a laser beam correcting tool is provided to increase thermal stress delivered to a cutting expected line of the glass substrates, thereby breaking the glass substrates only with laser beam and refrigerant. CONSTITUTION: A glass substrate cutting apparatus which includes a laser beam correcting tool comprises an initial cracking part(10), a laser irradiating part(20), and a quenching nozzle part(30). The initial cracking part forms a crack on a cutting starting point of the glass substrates(G). The laser-irradiating part comprises a shaping lens which refracts and patterns the laser beam and an optical proximity correction mask which secludes a part of the incident laser beam. The laser irradiating part scribes the cutting expected line by irradiating the laser beam. The quenching nozzle unit moves with the laser-irradiating part as one body. |
