发明名称 |
Positive resist composition and pattern forming method using the positive resist composition |
摘要 |
A positive resist composition comprises: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under action of an acid; and (C) a compound capable of decomposing under action of an acid to generate an acid.
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申请公布号 |
US8507172(B2) |
申请公布日期 |
2013.08.13 |
申请号 |
US20080523232 |
申请日期 |
2008.01.28 |
申请人 |
WADA KENJI;FUJIFILM CORPORATION |
发明人 |
WADA KENJI |
分类号 |
G03F7/039;G03F7/11;G03F7/20;G03F7/30 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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