发明名称 Positive resist composition and pattern forming method using the positive resist composition
摘要 A positive resist composition comprises: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under action of an acid; and (C) a compound capable of decomposing under action of an acid to generate an acid.
申请公布号 US8507172(B2) 申请公布日期 2013.08.13
申请号 US20080523232 申请日期 2008.01.28
申请人 WADA KENJI;FUJIFILM CORPORATION 发明人 WADA KENJI
分类号 G03F7/039;G03F7/11;G03F7/20;G03F7/30 主分类号 G03F7/039
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