发明名称 |
Adhesive composition, adhesive film and wiring film using the same |
摘要 |
An adhesive composition includes a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin. The maleimide compound has a plurality of maleimide groups in a structure and is at least one of a first maleimide compound having a melting temperature of 160� C. or lower and a gelling time at 200� C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160� C. or lower and a gelling time at 250� C. of 110 to 150 seconds. A heat resistant adhesive film may be formed by coating the adhesive composition on a substrate film, and a wiring film may have a conductor wiring layer put between such heat resistant adhesive films. |
申请公布号 |
US8507592(B2) |
申请公布日期 |
2013.08.13 |
申请号 |
US201113308591 |
申请日期 |
2011.12.01 |
申请人 |
AMOU SATORU;KUWABARA KOSUKE;ABE TOMIYA;KOMATSU HIROAKI;MURAKAMI KENICHI;HITACHI CABLE, LTD. |
发明人 |
AMOU SATORU;KUWABARA KOSUKE;ABE TOMIYA;KOMATSU HIROAKI;MURAKAMI KENICHI |
分类号 |
C08K5/34;B32B19/00 |
主分类号 |
C08K5/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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