| 摘要 |
<p>PURPOSE: An epoxy resin adhesive composition is provided to reduce the generation of static electricity and to facilitate heat discharge while having high adhesion between a base panel and a resin tile. CONSTITUTION: An epoxy resin adhesive composition includes a base material and a hardener with a mixing ratio of 2:1. The base material includes a basic type epoxy resin, a modified epoxy resin, a polyester resin, a methyl ethyl ketone solvent, an epoxysilane, graphite, a first filler applying viscosity, a second filler applying thixotropy, and a dispersant. The hardener includes a middle viscosity amide hardener, a low viscosity amide hardener, a catalyst accelerating the hardening, a methyl ethyl ketone solvent, an aminosilane improving adhesion, the first filler applying viscosity, and the second filler applying thixotropy.</p> |
