发明名称 APPARATUS FOR ETCHING GLASS WAFER
摘要 PURPOSE: A glass substrate etching device is provided to uniformly etch the top of the glass substrate by dropping an etchant on the top of the glass substrate with the minimum collision energy. CONSTITUTION: A glass substrate etching device comprises a cassette (200) and multiple supply tubes (100). The cassette has a frame (210), and enables the glass substrate (10) to be stood up. The multiple supply tubes are arranged in the side upper direction of the glass substrate, a nozzle (110) which sprays an etchant is arranged to the downward on side. At least part of the supply tubes is arranged in the right above part of the glass substrate. A central line of the spray range of the etchant which is extended from the nozzle is in the range of 0-40° from a horizontal plane to the lower side. Multiple buffering members (500) are arranged between the nozzle and the glass substrate. The buffer member has the plate-like or the cylindrical shape, and induces the etchant which is dropped down from the nozzle to the glass substrate.
申请公布号 KR20130089354(A) 申请公布日期 2013.08.12
申请号 KR20120010648 申请日期 2012.02.02
申请人 CHEONG SIN ENG. 发明人 JEONG, JAE GYU;KWAK, SUN PYO
分类号 C03C15/00;H01L21/306 主分类号 C03C15/00
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