发明名称 |
BUILT-IN TEST CIRCUIT AND METHOD |
摘要 |
A method of testing a semiconductor memory includes performing a first test of a first type prior to packaging the semiconductor memory. The first test of the first type includes generating a first plurality of addresses, decoding the first plurality of addresses to generate a second plurality of decoded addresses at a first decoder, and activating one of a plurality of rows or a plurality of columns of the semiconductor memory based on the second plurality of decoded addresses. The semiconductor memory is packaged after performing the first test of the first type. |
申请公布号 |
US2013201776(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201213365631 |
申请日期 |
2012.02.03 |
申请人 |
LIN TZU-KUEI;LIAO HUNG-JEN;CHEN YEN-HUEI;JAO FANG;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN TZU-KUEI;LIAO HUNG-JEN;CHEN YEN-HUEI;JAO FANG |
分类号 |
G11C29/00 |
主分类号 |
G11C29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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