| 摘要 |
PROBLEM TO BE SOLVED: To promptly rise and lower a temperature of a substrate when a peripheral portion of the substrate is processed with a process liquid.SOLUTION: A substrate processing apparatus includes: a substrate holding part (16) holding a substrate (W); a first process liquid nozzle (61) supplying a first process liquid to a peripheral portion of the substrate; a second process liquid nozzle (62) supplying a second process liquid, having a temperature lower than that of the first process liquid, to the peripheral portion of the substrate; first gas supply means (51, 53, etc.) supplying first gas having a first temperature to the peripheral portion of the substrate; and a second gas supply means (42, 45, etc.) supplying second gas having a second temperature lower than the first temperature to the center side of the substrate in a radius direction relative to a first gas supply position. |
