LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible semiconductor device by peeling an element produced by a process at a relatively low temperature (lower than 500°C) from a substrate.SOLUTION: A molybdenum film is formed on a glass substrate and a molybdenum oxide film is formed on a surface thereof using an existing apparatus for manufacturing a large-sized glass substrate. A nonmetal inorganic film and an organic compound film are laminated on the molybdenum oxide film, and an element produced by a process at a relatively low temperature (lower than 500°C) is formed on the organic compound film. Then, the element is peeled from the glass substrate.