LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A lead frame and a method for manufacturing the same, a semiconductor device and a method for manufacturing the same are provided to increase the adhesion of an encapsulating resin formed on the back surface of a die pad, by forming a first dimple with a negative slope side formed on the back surface of the die pad. CONSTITUTION: A first dimple (D1) is formed on the back surface of a die pad (10) by a first press process. The first dimple includes a first slope side (S1) and a vertical side. A second dimple (D2) is formed on the back surface of the die pad by a second press process. The second dimple includes a second slope side (S2). The vertical side of the first dimple has a negative profile side (Sx) opposite to the first slope side.