| 摘要 |
<p>Provided is a surface protecting adhesive tape for use in semiconductor processing, having an adhesive layer on a substrate, wherein the adhesive tape has a probe tack force B of 0.08 to 0.20 (MPa), and a ratio C (A/B) of an adhesive force A (N/25mm) of the adhesive tape to the probe tack force B (MPa) thereof is 10 (N/25mm/MPa) or more.</p> |
