发明名称 |
Photoresist-free metal deposition |
摘要 |
Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.
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申请公布号 |
US8500985(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US20070827800 |
申请日期 |
2007.07.13 |
申请人 |
MAYER STEVEN T.;DREWERY JOHN STEPHEN;WEBB ERIC G.;NOVELLUS SYSTEMS, INC. |
发明人 |
MAYER STEVEN T.;DREWERY JOHN STEPHEN;WEBB ERIC G. |
分类号 |
C25D5/34;B05D5/00;C25D5/00;C25D5/02 |
主分类号 |
C25D5/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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