发明名称 |
Grounding structures for header and receptacle assemblies |
摘要 |
A receptacle assembly includes a front housing configured for mating with a header assembly and a contact module coupled to the front housing. The contact module includes a conductive holder having a first side wall and an opposite second side wall. The conductive holder has a chamber between the first and second side walls. The conductive holder has a front coupled to the front housing. The contact module includes a frame assembly that is received in the chamber. The frame assembly includes a plurality of contacts and a dielectric frame that supports the contacts. The contacts extend from the conductive holder for electrical termination. A plurality of ground clips are received in the chamber and extend from the front of the conductive holder. The ground clips are mechanically and electrically connected to the conductive holder.
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申请公布号 |
US8500487(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US201113296852 |
申请日期 |
2011.11.15 |
申请人 |
MORGAN CHAD WILLIAM;MINNICK TIMOTHY ROBERT;SARASWAT DHARMENDRA;SWANGER NATHAN WILLIAM;PICKLES CHARLES S.;MCCLELLAN JUSTIN SHANE;SIPE LYNN ROBERT;FEDDER JAMES LEE;TYCO ELECTRONICS CORPORATION |
发明人 |
MORGAN CHAD WILLIAM;MINNICK TIMOTHY ROBERT;SARASWAT DHARMENDRA;SWANGER NATHAN WILLIAM;PICKLES CHARLES S.;MCCLELLAN JUSTIN SHANE;SIPE LYNN ROBERT;FEDDER JAMES LEE |
分类号 |
H01R13/648 |
主分类号 |
H01R13/648 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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