发明名称 Grounding structures for header and receptacle assemblies
摘要 A receptacle assembly includes a front housing configured for mating with a header assembly and a contact module coupled to the front housing. The contact module includes a conductive holder having a first side wall and an opposite second side wall. The conductive holder has a chamber between the first and second side walls. The conductive holder has a front coupled to the front housing. The contact module includes a frame assembly that is received in the chamber. The frame assembly includes a plurality of contacts and a dielectric frame that supports the contacts. The contacts extend from the conductive holder for electrical termination. A plurality of ground clips are received in the chamber and extend from the front of the conductive holder. The ground clips are mechanically and electrically connected to the conductive holder.
申请公布号 US8500487(B2) 申请公布日期 2013.08.06
申请号 US201113296852 申请日期 2011.11.15
申请人 MORGAN CHAD WILLIAM;MINNICK TIMOTHY ROBERT;SARASWAT DHARMENDRA;SWANGER NATHAN WILLIAM;PICKLES CHARLES S.;MCCLELLAN JUSTIN SHANE;SIPE LYNN ROBERT;FEDDER JAMES LEE;TYCO ELECTRONICS CORPORATION 发明人 MORGAN CHAD WILLIAM;MINNICK TIMOTHY ROBERT;SARASWAT DHARMENDRA;SWANGER NATHAN WILLIAM;PICKLES CHARLES S.;MCCLELLAN JUSTIN SHANE;SIPE LYNN ROBERT;FEDDER JAMES LEE
分类号 H01R13/648 主分类号 H01R13/648
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