TIN-PLATED COPPER ALLOY TERMINAL MATERIAL WITH EXCELLENT INSERTION AND DISCHARGE PERFORMANCE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A tin-plated copper alloy terminal material and a manufacturing method thereof are provided to have excellent insertion and discharge performances by decreasing the coefficient of kinetic friction to 0.3 or less while maintaining excellent electric connection. CONSTITUTION: A Sn-based surface layer is formed on a base substrate composed of Cu or Cu alloys. A CuNiSn alloy layer containing Ni is formed between the Sn-based surface layer and the base substrate. The CuNiSn alloy layer is composed of CuNiSn alloy particles having 10-40 at% of Ni, 0.1-0.8μm of mean diameters, and column-shaped crystals of which aspect ratios are 1.5 or more and rough CuNiSn alloy particles having 0.8μm or more of mean diameters. The mean thickness of the Sn-based surface layer is within 0.2-0.6μm. The surface ratio of the CuNiSn alloy layer exposed to the surface of the Sn-based surface layer is within 10-40%. The coefficient of kinetic friction of the CuNiSn alloy layer is 0.3 or less. [Reference numerals] (AA) CuNiSn alloy; (BB) Base material; (CC) CuSn alloy