发明名称 WAFER CONVEYING DEVICE AND WAFER CONVEYING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wafer conveying device capable of preventing cracks of a wafer.SOLUTION: The wafer conveying device comprises: a first location section 222; a first movement restraining section 223 for restraining plural wafers 881 located at the first location section from moving nearer an X1 side than a first arrangement position S11; a second location section 242; a second movement restraining section 243 for restraining the plural wafers located at the second location section from moving nearer an X2 side than a second arrangement position S12; a lifter for relatively moving the second location section to the first movement restraining section; and a liquid injection mechanism 261 for transferring a wafer. The second location part sequentially moves the plural wafers to an upper level than the first movement restraining section by collectively raising the plural wafers located at the first location section together with a relative movement to the first movement restraining section. The liquid injection mechanism for transferring the wafer injects the liquid to the wafer that is positioned at an upper level than the first movement restraining section and is moving from the first arrangement position to the second arrangement position among the plural wafers.
申请公布号 JP2013149706(A) 申请公布日期 2013.08.01
申请号 JP20120007751 申请日期 2012.01.18
申请人 NIPPON STEEL & SUMIKIN FINE TECHNOLOGY CO LTD 发明人 TSUKANAKA TEIHIKO;SEKIME HIRONARI
分类号 H01L21/677;B65G49/02;B65G49/07 主分类号 H01L21/677
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