发明名称 |
Semiconductor Package with Improved Testability |
摘要 |
An exemplary implementation of the present disclosure includes a testable semiconductor package that includes an active die having interface contacts and dedicated testing contacts. An interposer is situated adjacent a bottom surface of the active die, the interposer providing electrical connections between the interface contacts and a bottom surface of the testable semiconductor package. At least one conductive medium provides electrical connection between at least one of the dedicated testing contacts and a top surface of the testable semiconductor package. The at least one conductive medium can be coupled to a package-top testing connection, which may include a solder ball.
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申请公布号 |
US2013193996(A1) |
申请公布日期 |
2013.08.01 |
申请号 |
US201213362344 |
申请日期 |
2012.01.31 |
申请人 |
ZHAO SAM ZIQUN;HU KEVIN KUNZHONG;KARIKALAN SAMPATH K.V.;KHAN REZAUR RAHMAN;VORENKAMP PIETER;CHEN XIANGDONG;BROADCOM CORPORATION |
发明人 |
ZHAO SAM ZIQUN;HU KEVIN KUNZHONG;KARIKALAN SAMPATH K.V.;KHAN REZAUR RAHMAN;VORENKAMP PIETER;CHEN XIANGDONG |
分类号 |
G01R31/26;H01L23/544 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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