发明名称 PACKAGE, PACKAGE ASSEMBLY, AND PACKAGING METHOD
摘要 This package (1) is provided with stacks (5) including brittle thin plate materials (50), stack holding materials (6) which hold the stacks (5), and a packaging container which at least includes a body (4) having recesses (41). The stacks (5) are fitted in the recesses (41) together with the stack holding materials (6) while surfaces of the stacks (5) face the bottom surfaces of the recesses (41), the surfaces of the stacks (5) being those which are formed along the stack direction. As a result of this configuration, the brittle thin plate materials (50) are prevented from breaking.
申请公布号 WO2013111544(A1) 申请公布日期 2013.08.01
申请号 WO2013JP00213 申请日期 2013.01.17
申请人 NIPPON SHOKUBAI CO., LTD. 发明人 TAKAKI, YUTAKA;NISHIYAMA, KENGO;SAKAMOTO, KATSUHIKO;HATA, KAZUO
分类号 B65D85/86;B65D77/04;B65D81/113;B65D85/44 主分类号 B65D85/86
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