| 摘要 |
A solder ball mounting apparatus and a mounting method thereof are provided to reduce a process time by preventing a process error such as a solder ball bridge effect. A solder ball mounting apparatus for mounting solder balls(220) on a semiconductor substrate(230) includes a tray(210) and a lid(250). A plurality of grooves(216) are formed in an inner base surface of the tray. The solder balls are arranged in the grooves. The semiconductor substrate is loaded into a reception space of the tray. The lid is formed to cover the semiconductor substrate. The tray includes a base part(212) and a sidewall(218). The grooves are formed on a surface of the base part. The sidewall is formed at an edge of the base part to form the reception space. |
