| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and method of manufacturing a semiconductor device capable of improving a yield by reducing a bonding failure region on a bonding surface between a first substrate and a second substrate.SOLUTION: A system of manufacturing a semiconductor device according to an embodiment has a spontaneous junction part and a deformation junction part. The spontaneous junction part polymerizes a first substrate and a second substrate to make central parts of respective bonding surfaces in the first and second substrates spontaneously bond with each other. The deformation junction part deforms at least any one peripheral edge of the respective bonding surfaces in the first and second substrates bonded by the spontaneous junction part toward the other peripheral edge to bond the peripheral edges of the respective bonding surfaces with each other. |
