发明名称 METHOD FOR MANUFACTURING A REFLECTOR FOR LED CHIP MOUNTED PRINTED CIRCUIT BOARD
摘要 PURPOSE: A method for manufacturing a reflection plate on a light emitting diode mounting circuit board is provided to reduce production costs by using a general PCB material. CONSTITUTION: A copper thin film is coated on both surfaces of an insulating layer (100c). The coated material is used as a reflection layer. A cavity is formed in the preset position of the reflection layer. A copper coating layer (120) is formed on the wall of the cavity. A bonding surface between a printed circuit board and the reflection layer is adhered by a bonding sheet.
申请公布号 KR101292197(B1) 申请公布日期 2013.08.01
申请号 KR20120037098 申请日期 2012.04.10
申请人 DAE DUCK ELECTRONICS CO., LTD. 发明人 NA, EUN SUNG;KIM, SANG JIN
分类号 H01L33/60;H01L33/48;H05K1/18 主分类号 H01L33/60
代理机构 代理人
主权项
地址