发明名称 |
METHOD FOR MANUFACTURING A REFLECTOR FOR LED CHIP MOUNTED PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE: A method for manufacturing a reflection plate on a light emitting diode mounting circuit board is provided to reduce production costs by using a general PCB material. CONSTITUTION: A copper thin film is coated on both surfaces of an insulating layer (100c). The coated material is used as a reflection layer. A cavity is formed in the preset position of the reflection layer. A copper coating layer (120) is formed on the wall of the cavity. A bonding surface between a printed circuit board and the reflection layer is adhered by a bonding sheet. |
申请公布号 |
KR101292197(B1) |
申请公布日期 |
2013.08.01 |
申请号 |
KR20120037098 |
申请日期 |
2012.04.10 |
申请人 |
DAE DUCK ELECTRONICS CO., LTD. |
发明人 |
NA, EUN SUNG;KIM, SANG JIN |
分类号 |
H01L33/60;H01L33/48;H05K1/18 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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