| 摘要 |
PROBLEM TO BE SOLVED: To increase reliability of interconnection between electrical connection points on circuit substrates based on a conductive resin.SOLUTION: An embodiment has a circuit substrate, and an electrical connection point 202 on the circuit substrate. The electrical connection point 202 includes a lattice 212 of conductive material, the lattice 212 being adjacent to a gap in the circuit substrate and having anchor points of cover lay 220 material that are attached to the circuit substrate. A conductive epoxy resin encapsulates at least a portion of the lattice 212 of the conductive material. |
