发明名称 |
Semiconductor packaging system with an aligned interconnect and method of manufacture thereof |
摘要 |
A method of manufacture of a semiconductor packaging system includes: providing a base substrate having edges; mounting an electrical interconnect on the base substrate; and applying an encapsulant having a reference marker and an opening over the electrical interconnect, the reference marker around the electrical interconnect based on physical locations of the edges.
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申请公布号 |
US8497575(B2) |
申请公布日期 |
2013.07.30 |
申请号 |
US20100710359 |
申请日期 |
2010.02.22 |
申请人 |
YOON IN SANG;BAE JOHYUN;YANG DEOKKYUNG;STATS CHIPPAC LTD. |
发明人 |
YOON IN SANG;BAE JOHYUN;YANG DEOKKYUNG |
分类号 |
H01L21/00;H01L21/44;H01L23/02;H01L23/06;H01L23/28;H01L23/48 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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