发明名称 METHOD FOR DEPOSITING FILM AND FILM DEPOSITION SYSTEM
摘要 <p>Provided is a film formation apparatus that can efficiently form an anti-contamination film that can withstand actual use while also having improved abrasion resistance. A film formation apparatus (1) in which a substrate holder (12) that has a substrate holding surface for holding a plurality of substrates (14) is disposed rotatably within a vacuum vessel (10), said film formation apparatus (1) comprising: an ion source (38) mounted within the vacuum vessel (10) so as to have a configuration, position and orientation such that an ion beam can be radiated to an area that is a part of the substrate holding surface; and a vapor deposition source (34) and a control plate (36) that act as film formation means mounted within the vacuum vessel (10) so as to have a configuration such that the film formation material can be supplied to a region which is a part of the substrate holding surface and which overlaps at least a part of the ion beam radiation area irradiated by the ion source (38).</p>
申请公布号 KR20130084967(A) 申请公布日期 2013.07.26
申请号 KR20127001275 申请日期 2011.09.30
申请人 SHINCRON CO., LTD. 发明人 SHIONO ICHIRO;MIYAUCHI MITSUHIRO;JIANG YOUSONG
分类号 C23C14/02;C23C14/22 主分类号 C23C14/02
代理机构 代理人
主权项
地址