| 摘要 |
PROBLEM TO BE SOLVED: To extract light from not only the substrate side of a light emitting element but also from the mounting surface side thereby improving the light extraction efficiency and concurrently enable efficient heat radiation when the light emitting element is mounted on a connection terminal in a flip chip method.SOLUTION: A light emitting device 200 includes: a light emitting element 110; and a connection member 220 which includes a wiring layer 230 connected with the light emitting element 110 and where the light emitting element 110 is placed; and a translucent member 140 sealing the light emitting element 110 and a part of the connection member 220, the translucent member 140 having a substantially sphere shape with the light emitting element 110 located at a center of the sphere. In the light emitting device 200, the connection member 220 is formed into a substantially frustum shape including an upper surface on which the light emitting element 110 is placed and a lower surface having an area larger than that of the upper surface and facing the upper surface. The area of the upper surface is formed so as to be smaller than an area of a surface of the light emitting element 110 that is placed on the connection member 220. |
