SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent a high resistance value of wiring caused by an out gas from a base resin layer when wiring is formed on the base resin layer by a droplet discharge method or a printing method and calcined.SOLUTION: A semiconductor package manufacturing method comprises: mounting an LED element 14 on the center of a bottom surface of an element mounting recess 12 of a mounting component 10; forming a base resin layer 16 by filling a fluent insulating resin in the element mounting recess 12 around the LED element 14 and hardening the insulating resin; planarizing a wiring path between an electrode part 15 on a top face of the LED element 14 and an electrode part 11a on a top face of the mounting component 10 by the base resin layer 16; subsequently, drawing an intermediate insulation layer 18 having a gas barrier property linearly or in a belt-shape on the base resin layer 16 by a droplet discharge method or a printing method; and discharging or printing a conductive ink on the intermediate insulation layer 18 to draw and calcine a pattern. At the time of calcination, an out gas generated at the base resin layer 16 is prevented by the intermediate insulation layer 18 from entering the wiring 17 to the inside.