| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical device sealing structure and method which can appropriately perform hermetic sealing of an optical device while reducing cost and weight.SOLUTION: A metallic package 3 includes a housing 19 for housing an optical device, and a lid 20 provided on the top of the housing 19. The housing 19 and the lid 20 are formed of one light metal among Al, an Al alloy, Mg, and a Mg alloy. An Sn layer 22 is formed on the surface of the housing 19, and an Sn layer 24 is formed on the surface of the lid 20. The melting point of the Sn layers 22 and 24 is lower than that of metal forming the housing 19 and the lid 20. The housing 19 and the lid 20 are bonded to each other by being locally heated by resistance seam welding or heat sealing. As a result, the Sn layer 22 formed on the surface of the housing 19 and the Sn layer 24 formed on the surface of the lid 20 are diffusion-bonded to each other. |
