发明名称 Apparatus and method for analyzing contaminants on wafer
摘要 Provided is an apparatus and method for analyzing contaminants on a wafer. The apparatus includes: a wafer holder for supporting a wafer on which contaminants to be analyzed are located, a laser ablation device for irradiating a laser to the wafer to extract a discrete specimen from the wafer, an analysis cell for collecting a discrete specimen from the surface of the wafer by irradiating the laser, and an analysis device connected to the analysis cell for analyzing contaminants from the collected discrete specimen.
申请公布号 US7880138(B2) 申请公布日期 2011.02.01
申请号 US20070963662 申请日期 2007.12.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE JAE-SEOK;LIM HEUNG-BIN;RYU WON-KYUNG;CHAE SEUNG-KI;LEE YANG-KOO;YI HUN-JUNG
分类号 H01J49/26;G01N21/00 主分类号 H01J49/26
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