发明名称 |
Apparatus and method for analyzing contaminants on wafer |
摘要 |
Provided is an apparatus and method for analyzing contaminants on a wafer. The apparatus includes: a wafer holder for supporting a wafer on which contaminants to be analyzed are located, a laser ablation device for irradiating a laser to the wafer to extract a discrete specimen from the wafer, an analysis cell for collecting a discrete specimen from the surface of the wafer by irradiating the laser, and an analysis device connected to the analysis cell for analyzing contaminants from the collected discrete specimen.
|
申请公布号 |
US7880138(B2) |
申请公布日期 |
2011.02.01 |
申请号 |
US20070963662 |
申请日期 |
2007.12.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JAE-SEOK;LIM HEUNG-BIN;RYU WON-KYUNG;CHAE SEUNG-KI;LEE YANG-KOO;YI HUN-JUNG |
分类号 |
H01J49/26;G01N21/00 |
主分类号 |
H01J49/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|