发明名称 |
VAPOR PHASE COOLING APPARATUS AND ELECTRONIC EQUIPMENT USING SAME |
摘要 |
A vapor phase cooling apparatus (10) includes: a housing (11) including a heat receiver (14a) configured to receive heat generated by an electronic component (50) that is a heat generating source, the electronic component (50) being connected to a vertical outer surface on the +Z side of the housing, the housing including an internal space for enclosing refrigerant; and a first heat sink (21) and a second heat sink (22) that are disposed on the +Y side and the -Y side from the electronic component (50) and that dissipate heat to the outside. Both ends of the first heat sink (21) and the second heat sink (22) in X direction extend further along the surface on the +Z side than both ends of the heat receiver (14a) in X direction.
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申请公布号 |
US2013188314(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
US201113824908 |
申请日期 |
2011.08.31 |
申请人 |
MATSUNAGA ARIHIRO;SAKAMOTO HITOSHI;YOSHIKAWA MINORU;NEC CORPORATION |
发明人 |
MATSUNAGA ARIHIRO;SAKAMOTO HITOSHI;YOSHIKAWA MINORU |
分类号 |
H05K7/20;F28D15/02;F28F13/06 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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