发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR RESIST PATTERN FORMATION, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 This invention provides a photosensitive resin composition comprising (A) a binder polymer comprising a divalent group represented by general formula (I), a divalent group represented by general formula (II), and a divalvent group represented by general formula(III), (B) a photopolymerizable compound, and (C) a photopolymerization initiator comprising a hexaarylbiimidazole compound containing at least one alkoxy group having 1 to 5 carbon atoms. (I) (II) (III) wherein R<SUP>1</SUP>, R<SUP>3</SUP>, and R<SUP>5</SUP> each independently represent a hydrogen atom or a methyl group; R<SUP>2</SUP> and R<SUP>4</SUP> each independently represent an alkyl group having 1 to 3 carbon atoms, an alkoxy group, an OH group, or a halogen atom; and m and n are each independently an integer of 0 to 5.
申请公布号 KR101289569(B1) 申请公布日期 2013.07.24
申请号 KR20127012619 申请日期 2007.11.22
申请人 发明人
分类号 G03F7/004;G03F7/031;G03F7/033 主分类号 G03F7/004
代理机构 代理人
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