发明名称 |
Polishing pad, use thereof and method for making the same |
摘要 |
The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
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申请公布号 |
US8491359(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US20100862098 |
申请日期 |
2010.08.24 |
申请人 |
FENG CHUNG-CHIH;YAO I-PENG;HUNG YUNG-CHANG;WANG LYANG-GUNG;WU WEN-CHIEH;BESTAC ADVANCED MATERIAL CO., LTD. |
发明人 |
FENG CHUNG-CHIH;YAO I-PENG;HUNG YUNG-CHANG;WANG LYANG-GUNG;WU WEN-CHIEH |
分类号 |
B32B5/32;B24B37/22 |
主分类号 |
B32B5/32 |
代理机构 |
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代理人 |
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地址 |
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