发明名称 Heat sinking element and method of treating a heat sinking element
摘要 A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
申请公布号 US8492003(B2) 申请公布日期 2013.07.23
申请号 US20100981525 申请日期 2010.12.30
申请人 WANG CHENG-CHUAN;YEN CHIA-YING;CHEN HSIN-HWA;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 WANG CHENG-CHUAN;YEN CHIA-YING;CHEN HSIN-HWA
分类号 B32B15/20;C25D11/18;F28F21/08;H05K7/20 主分类号 B32B15/20
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