发明名称 |
Heat sinking element and method of treating a heat sinking element |
摘要 |
A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
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申请公布号 |
US8492003(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US20100981525 |
申请日期 |
2010.12.30 |
申请人 |
WANG CHENG-CHUAN;YEN CHIA-YING;CHEN HSIN-HWA;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WANG CHENG-CHUAN;YEN CHIA-YING;CHEN HSIN-HWA |
分类号 |
B32B15/20;C25D11/18;F28F21/08;H05K7/20 |
主分类号 |
B32B15/20 |
代理机构 |
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