发明名称 CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT MODULE USING CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a ceramic substrate 1 capable of mounting an electronic component such as a light emitting diode.SOLUTION: A ceramic substrate 1 comprises: a ceramic substrate part 2; at least one terminal part 4 formed on the ceramic substrate part 2 for connecting an electronic component 3 thereto; and at least one wiring part 5 in which an electric circuit pattern is formed on the ceramic substrate part 2. It is possible to provide the ceramic substrate 1 capable of mounting an electronic component such as a light emitting diode, because the ceramic substrate 1 has the terminal part 4 having a thickness being thicker than that of the wiring part 5.
申请公布号 JP2013143411(A) 申请公布日期 2013.07.22
申请号 JP20120001760 申请日期 2012.01.10
申请人 PANASONIC CORP 发明人 AIHARA TAKASHI
分类号 H01L33/62;H01L23/12;H01L33/60 主分类号 H01L33/62
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