COPPER FOIL ATTACHED TO CARRIER FOIL, A METHOD FOR PREPARING THE SAME AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A carrier foil attachment ultra thin copper foil, a manufacturing method thereof, and a print circuit board adopting the same are provided to improve laser workability of the carrier foil attachment ultra thin copper foil by including a peeling layer having low reflectivity for light of wavelength which is oscillated from a carbon dioxide laser. CONSTITUTION: A carrier foil attachment ultra thin copper foil is formed by successively laminating carrier foil, a peeling layer, and ultra thin copper foil. The peeling layer has low reflectivity for light of wavelength which is oscillated from a carbon oxide gas laser. The peeling layer comprises first metal having detachability and second metal and third metal which easily facilitate the first metal. The first metal is Mo or W. The second metal and the third metal are two different metals which are selected in a group formed of Fe, Co, and Ni.