发明名称 |
PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM |
摘要 |
The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (alpha) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (alpha) by a wet-mode plating technique, wherein the compound (alpha) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
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申请公布号 |
US2013183534(A1) |
申请公布日期 |
2013.07.18 |
申请号 |
US201113823526 |
申请日期 |
2011.09.30 |
申请人 |
MORI KUNIO;MATSUNO YUSUKE;KUDO TAKAHIRO;MICHIWAKI SHIGERU;MIYAWAKI MANABU;KUNIO MORI;MEIKO ELECTRONICS CO., LTD.;SULFUR CHEMICAL INSTITUTE INCORPORATED |
发明人 |
MORI KUNIO;MATSUNO YUSUKE;KUDO TAKAHIRO;MICHIWAKI SHIGERU;MIYAWAKI MANABU |
分类号 |
C23C18/20;C25D11/00 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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